High Performance--EGC High-Performance Thermal Compound 4 Grams
EGC's High-Performance thermal compound is specifically tailored for
system-builders looking to get the most thermal conductivity between
their processor and heatsink/CPU fan. With 4G of high-density thermal
compound you can cover nearly 30 CPU cores. Thermal compound has never
been easier to apply with the included application-stick.
- High-performance thermal compound maximizes thermal conductivity
- Easy to apply with the included application-stick
- Thermal conductivity: > 5.15 W/mk
- Perfect for enthusiasts and system-builders looking looking for optimal cooling
- 45% Matal Oxide Compounds / 45% Carbon Compounds / 10% Silicone Compounds
High Performance--EGC High-Performance Thermal Compound 4 Grams
